On August 17, the U.S. Department of Commerce announced a new round of sanctions against Huawei. In addition to listing 38 Huawei subsidiaries in the “entity list”, it also announced that it would further restrict Huawei’s ability to purchase chips. < p > < p > from restricting the production of self-developed chips to restricting the purchase of non self-developed chips, Huawei’s terminal business is full of thorns. In May this year, on the occasion of the one-year anniversary of Huawei’s “physical list”, the United States announced that it would restrict and upgrade its restrictions. In the future, it would strictly control the supply of Huawei by overseas semiconductor manufacturers using American technology and equipment. In this context, Huawei has successively made a “handshake” with Qualcomm and MediaTek. It seems that the brand intends to purchase ready-made chip products directly from third-party enterprises, so as to “save the country by curve” and alleviate the urgent need of its “lack of core”. On the other hand, China is accelerating the cultivation of integrated circuit chip manufacturing enterprises represented by SMIC international, from which Huawei can obtain the real “domestic chip” future. However, “in May, we issued an order to prevent us technology from being used on Huawei designed chips. This has led them to take some evasive measures, which can be obtained through a third party. ” U.S. Commerce Secretary Ross said that there were “loopholes” in the U.S. restrictive measures against Huawei, which only restricted the design and manufacture of Huawei’s self-developed core chips, including Kirin series, but failed to prevent Huawei from directly purchasing chip products from chip manufacturers such as Qualcomm, MediaTek and SMIC international. For this reason, Huawei’s “outsourcing” plan is to expand the U.S. commercial channel. < p > < p > this means that not only Huawei’s ability to independently develop, design and manufacture chips will be suppressed in the future, but also its channels to buy chips from the outside world may be cut off completely. < / P > < p > at present, both overseas companies such as Qualcomm, MediaTek, Samsung, and SMIC in China all need to design with the help of EDA (Electronic Design Automation) and other software in the United States, or use American manufacturing equipment to produce semiconductor products. For example, “SMIC has announced the realization of mass production of 14nm process chips, which actually need to be completed with the help of us equipment.” According to sun Yanbiao, President of the first mobile phone industry research institute, the Kirin 710A processor based on SMIC’s 14nm technology has been used in glory play4t smart phones. In the future, if “the United States strictly implements the restrictive measures and insists on not issuing licenses”, then theoretically, “not only mobile phones, but also Huawei’s computers and even base station chips may face the problem of” missing cores. ” < / P > < p > in addition, other core supply chain enterprises with close business contacts with Huawei may also be affected in Sony, SK Hynix, Dali optoelectronics, Infineon and other technology fields. < / P > < p > “the worst may not be here yet.” At the 2020 summit of the 100 people’s Congress of China’s informatization a few days ago, Wu Hequan, an academician of the Chinese Academy of engineering, predicted that Huawei’s “core shortage” dilemma would continue under the Sino US game. < / P > < p > “we need to build our ecology, our operating system, our ecological services, our chips, our equipment and equipment, and our entire basic system capability. For us, sanctions are painful, but at the same time, they are a major opportunity to force us to upgrade the real estate industry as soon as possible. ” Yu Chengdong, CEO of Huawei’s consumer business, once said that Huawei would try its best to make up for its shortcomings in semiconductor manufacturing and ecological construction in the short term. However, in the long run, only by “strengthening cooperation” with all parties in the industrial chain and trying to “break through the capabilities of EDA design, materials, manufacturing, process, design capability, manufacturing, packaging and testing” can be realized It is “breaking the game”. Wu Hequan also believes that China’s science and technology enterprises should have a foothold in the field of semiconductors in the future, “the most important thing is whether (the country) can start from the most basic industrial foundation and quickly establish and improve the industrial chain and supply chain system.” He proposed that in the most critical links such as chemical materials and manufacturing technology, only by making efforts at the national level and laying a solid foundation in the process of continuous “trial and error”, can the country and the enterprise itself remain invincible in the long-term scientific and technological competition in the future.