The advanced system on wafer (SOW) packaging technology of TSMC integrated fan out (info) system is adopted. It is expected to start production in the fourth quarter, with about 2000 pieces in the initial stage. < / P > < p > according to industry news, Broadcom and Tesla have cooperated to develop ultra large size HPC chips for vehicles, which are produced by TSMC’s 7-nm process. For the first time, TSMC’s sow advanced packaging technology is used. Only about 25 chips can be cut out per 12 inch wafer. Production of the new chip will start in the fourth quarter, with about 2000 chips in the initial stage. It is expected to enter the full-scale production stage after the fourth quarter of next year. < p > < p > it is understood that the HPC chip created by Broadcom for Tesla will become the core computing special application chip (ASIC) of Tesla electric vehicles in the future, which can be used to control and support the four application fields of vehicle electronics, including advanced driving assistance system, electric vehicle power transmission, vehicle entertainment system, and body electronic components, and further support the real-time transportation required by self driving Yes. The HPC chip developed by botom and Tesla should be an important cooperation project from electric vehicle to self driving. < / P > < p > as early as 2016, Tesla began to establish a team of chip architects led by chip designer Jim Keller to develop its own chips, with the aim of designing a super large and efficient chip for autonomous driving. Last year, Tesla officially announced the chip. Tesla says it processes 21 times more frames per second than the previous generation of Tesla autopilot hardware, which uses NVIDIA hardware, but only increases power consumption. At the launch of the new chip, CEO Elon Musk announced that Tesla was already developing the next generation chip and they wanted it to be three times better than this one. However, it seems that Tesla wants to enter the 7 nm process. According to the industrial and commercial times, the chip will be used in “advanced driving assistance system” and “autopilot”, which make us believe that the HPC chip is Tesla’s HW 4 chip. The schedule in the report is to start mass production as early as the fourth quarter of 2020, but is likely to be used for engineering validation. Mass production may not be available until the fourth quarter of 2021 – which means we won’t see the chip in the Tesla mass production vehicle until 2022.